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Selection Guide

Integrated OBC + DCDC Selection Guide

Use this guide to compare integrated power-module options by charging demand, auxiliary load profile, packaging constraints, and integration workflow maturity.

Best practice: evaluate module power and installation envelope together, not as separate decisions.

Selection Workflow

Start with application boundaries, then narrow to a practical shortlist.

  1. Step 1

    Define integration target

    Set charger power, low-voltage load, and packaging constraints before comparing integrated module options.

  2. Step 2

    Select power tier and integration depth

    Compare 3.3k/400W and 6.6k/1.5k baselines, then decide 2-in-1 or deeper function integration.

  3. Step 3

    Validate interface and pilot envelope

    Close CAN mapping, thermal margin, harness simplification plan, and sample validation checkpoints.

Key Selection Matrix

Use this matrix to screen options before requesting detailed proposal and datasheets.

Decision Factor How to Choose Quick Verification
Charging and DCDC load profile Use 3.3k/400W for compact-duty platforms and 6.6k/1.5k for higher throughput systems. Check charging window plus auxiliary load peak against continuous duty margin.
Packaging constraints Choose integrated module when harness reduction and installation space are priority constraints. Compare enclosure footprint and connector count against separated OBC + DCDC layout.
Cooling and thermal budget Reserve derating margin for high-temperature duty and restricted airflow conditions. Run thermal simulation with worst-case ambient and enclosure assumptions.
Interface consistency Lock communication boundaries across BMS, controller, and telematics before pilot freeze. Confirm signal map and fault-priority logic in system-level interface matrix.

Scenario-to-Model Mapping

Start from operating scenario and architecture targets to jump directly to a practical shortlist.

Compact integration project

Medium-duty EV with limited installation volume

Start with ZI-3.3K/400W to balance packaging efficiency and baseline power demand.

This tier usually reduces harness complexity while maintaining manageable thermal design.

Open ZI-3.3K/400W
Higher-throughput platform

Demanding duty cycle with stronger charging and auxiliary load

Use ZI-6.6K/1.5K as default for higher power and deeper integration readiness.

Higher power headroom supports faster charging rhythm and heavier low-voltage consumers.

Open ZI-6.6K/1.5K
Architecture-specific platform

Unique wiring, software, or mechanical envelope requirements

Move to Customized integrated pathway with staged scope definition.

Custom path avoids repeated redesign when standard boundaries do not fit project constraints.

Open Customized Path

Recommended Model Shortlist

Each item includes the fit boundary so procurement and engineering teams can align faster.

ZI-3.3K/400W

Compact integrated option combining OBC and DCDC for space-sensitive vehicle programs.

Best fit: medium-duty platforms prioritizing installation simplicity.

Open Product Specs

ZI-6.6K/1.5K

Higher-power integrated package for stronger charging throughput and auxiliary support.

Best fit: higher utilization fleets requiring faster turnaround.

Open Product Specs

Customized Integrated

Custom integration pathway when standard power tiers or interface boundaries are insufficient.

Best fit: OEM projects with architecture-level differentiation needs.

Open Product Specs

Common Selection Mistakes to Avoid

These are high-frequency issues seen during integration and pilot validation.

  • Selecting by power only: Include mechanical envelope, harness simplification, and service access constraints in early evaluation.
  • Late communication mapping: Freeze subsystem signal ownership before pilot build to avoid integration delays.
  • No derating allowance: Reserve thermal and duty-cycle margin to protect long-term reliability in field conditions.
  • Skipping staged pilot gates: Use phased verification for electrical, software, and thermal checkpoints before scaling.

Selection FAQ

When should integrated modules replace separate OBC and DCDC units?

Choose integrated modules when packaging efficiency, harness simplification, and integration speed are key project priorities.

How do I choose between 3.3k/400W and 6.6k/1.5k quickly?

Start from charging window, low-voltage load profile, and duty-cycle intensity. If headroom is tight, prioritize the higher tier.

Can integrated modules align with existing BMS and controller workflows?

Yes. Interface and CAN strategy can be mapped in pilot phase and validated through staged integration tests.

What should procurement prepare before quote request?

Prepare power targets, packaging envelope, communication constraints, and rollout timeline to shorten proposal cycles.

Need an Integrated Architecture Baseline?

Share your charging targets, low-voltage load, and packaging envelope. We will return a shortlist with integration checkpoints.

Request Architecture Review